Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlighted the need to address performance and energy efficiency challenges faced during the implementation process. To address these challenges, there has been growing interest in neuromorphic chips. Neuromorphic computing relies on non von Neumann architectures as well as novel devices, circuits and manufacturing technologies to mimic the human brain. Among such technologies, 3D integration is an important enabler for AI hardware and the continuation of the scaling laws. In this paper, we overview the unique opportunities 3D integration provides in neuromorphic chip design, discuss the emerging opportunities in next generation neuromorphic architectures and review the obstacles. Neuromorphic architectures, which relied on the brain for inspiration and emulation purposes, face grand challenges due to the limited understanding of the functionality and the architecture of the human brain. Yet, high-levels of investments are dedicated to develop neuromorphic chips. We argue that 3D integration not only provides strategic advantages to the cost-effective and flexible design of neuromorphic chips, it may provide design flexibility in incorporating advanced capabilities to further benefits the designs in the future.

翻译：过去十年来,人工智能在社会上发现了许多应用领域。随着人工智能解决方案变得更加复杂,使用案例增多,他们强调需要应对执行过程中面临的性能和能效挑战。为了应对这些挑战,人们越来越关注神经畸形芯片。神经突变计算依靠的是非冯纽曼建筑以及模仿人类大脑的新装置、电路和制造技术。在这类技术中,3D整合是AI硬件和扩展法持续的重要推动者。在本文中,我们概述了3D整合在神经变形芯片设计中提供的独特机会,讨论了下一代神经变形结构中新出现的机遇,并审查了障碍。神经变形结构依赖大脑进行灵感和模拟,由于对人体大脑功能和结构的了解有限,面临巨大挑战。然而,高水平的投资专门用于开发神经变形芯片。我们认为,3D整合不仅为神经变形芯片的成本效益和灵活设计提供了战略优势,而且为未来设计进一步受益提供了设计所需的灵活性。