The increase in the number of counterfeit and recycled microelectronic chips in recent years has created significant security and safety concerns in various applications. Hence, detecting such counterfeit chips in electronic systems is critical before deployment in the field. Unfortunately, the conventional verification tools using physical inspection and side-channel methods are costly, unscalable, error-prone, and often incompatible with legacy systems. This paper introduces a generic non-invasive and low-cost counterfeit chip detection based on characterizing the impedance of the system's power delivery network (PDN). Our method relies on the fact that the impedance of the counterfeit and recycled chips differs from the genuine ones. To sense such impedance variations confidently, we deploy scattering parameters, frequently used for impedance characterization of RF/microwave circuits. Our proposed approach can directly be applied to soldered chips on the system's PCB and does not require any modifications on the legacy systems. To validate our claims, we perform extensive measurements on genuine and aged samples from two families of STMicroelectronics chips to assess the effectiveness of the proposed approach.

翻译：近年来,仿造和再循环微电子芯片数量的增加在各种应用中造成了严重的安保和安全问题。因此,在部署实地之前,在电子系统中发现这种假冒芯片至关重要。不幸的是,使用实物检查和侧道方法的常规核查工具费用昂贵、无法伸缩、容易出错,而且往往与遗留系统不相容。本文件根据系统电力输送网络的阻力特征,采用了通用的非侵入和低成本的假冒芯片检测方法。我们的方法依据的事实是,假冒和再循环芯片的阻力与真实的芯片不同。要有信心地感觉到这种阻力变化,我们部署散射参数,经常用于阻塞RF/微波电路特征。我们提议的方法可以直接适用于系统多氯联苯上的焊接芯片,不需要对遗留系统作任何修改。为了证实我们的说法,我们对STMicroephics芯片的两个家族的真实和老旧样品进行了广泛的测量,以评估拟议方法的有效性。